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Stabilizing dilute sulfuric-peroxide microetch solutions with copper ions

The use of dilute sulfuric-peroxide based microetch solutions in PCB fabrication faces a significant challenge: maintaining stability in the presence of dissolved copper ions. Current solutions like persulfate-based microetch are stable but have drawbacks such as leaving heavy sulfate residues and oxidizing copper faster. The goal is to find a stabilizer that can maintain a stable ORP for a longer period without the oxidizer rapidly consuming itself.

Engineering, Core Engineering, Electrical Engineering