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Improving Electroless Copper Plating Initiation on Non-Conductive Epoxy Fiberglass Sheets

The electronics industry faces a challenge in initiating electroless copper plating on non-conductive, chemically resistant epoxy-fiberglass sheets used in printed circuit boards. Current methods, such as palladium seeding, have limitations. There is a need for more reliable and efficient methods.

Engineering, Core Engineering, Materials Science