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Overcoming Bottlenecks in Commercializing 2D Materials on CMOS

The integration of 2D materials on CMOS faces significant challenges in transitioning from lab simulations to commercial viability. The main bottlenecks are unclear, but large-scale transfer yield and CTE mismatch during thermal cycling are suspected. Identifying the biggest bottleneck is crucial for advancing commercialization.

Engineering, Core Engineering, Nanotechnology